Tuesday, May 22, 2018
Home/Current Issue >  Daily News Archive > 

NEPCON China 2018 Highlights Uptick in Chinese Electronics Market

By Michael Skinner, Editor

After a couple of level years of growth in the Asian market, this year’s NEPCON China saw the electronics industry on a marked upswing. From April 24 to 26, hundreds of leading PCB equipment manufacturers gathered, attracting thousands of visitors to Shanghai for three days of conferences and exhibition.           

Read More

General Cable to Introduce New EmPowr CL Edge™ MV Cable

Debut to be made at the 2018 AWEA WINDPOWER Conference

HIGHLAND HEIGHTS, KY – General Cable (NYSE: BGC) is excited to introduce its new EmPowr CL Edge™ medium-voltage (MV) cable at the upcoming American Wind Energy Association (AWEA) WINDPOWER Conference being held in Chicago, IL from May 7-10.        
Read More

Indium Corporation Expert to Present at SMTA Southeast Asia Technical Conference on Electronics Assembly

CLINTON, NY - Indium Corporation’s Jeffrey Len, Technical Support Engineer, will share his expertise at the SMTA Southeast Asia Technical Conference on Electronics Assembly on Tuesday, May 22, at the Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia.      

Read More


Booth S24179

ADRIAN, MI - WACKER, the Munich based Chemi-cal Company is showcasing GENIOPLAST® PP50S12, a novel all-around masterbatch additive for polypropylene compounds at the 2018 NPE: The Plastics Show. GENIOPLAST® PP50S12 is an ultra-high molecular weight silicone gum additive which im-proves scratch and mar performance, reduces the coefficient of friction and provides a soft and non-tacky surface.     
Read More

Pickering Interfaces to Feature Latest RF and Microwave Switching Solutions at IEEE MTT-S 2017 International Microwave Symposium (IMS)

Preview for IMS – Philadelphia, PA USA – Booth 2015

Pickering Interfaces, a leading provider of signal switching and simulation solutions used in electronic test and verification, will showcase their broad catalog of PXI and Ethernet LXI RF & Microwave switching solutions at IEEE MTT-S 2018 International Microwave Symposium (IMS) at booth 2015 on June 10 – 15, 2018.        

Read More

Nordson YESTECH FX-942 Automated Optical Inspection System Recognized for Excellence by Asian Electronics Industry

CARLSBAD, CA - Nordson YESTECH, a subsidiary of Nordson Corporation (NASDAQ: NDSN) and a leading supplier of automated optical and conformal coat inspection systems for the electronics industry, announces that it was recognized with two awards for its FX-942 Dual-sided Automated Optical Inspection (AOI) system.   
Read More

Ironwood Introduces Clamshell Production Test Socket for BGA1296

Socket and Test your 37.5x37.5mm BGA device using extreme temperature socket

EAGAN, MN - Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA1296 - CBT-BGA-6076. The contactor is a stamped spring pin with 19 gram actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 21.9 GHz and capacitance 0.097pF.     
Read More

Thermaltronics Launches the TMT-HA100 Digital Hot Air Pencil

NEW YORK - Convection rework is becoming increasingly important due to the prevalence of surface mount components and the difficulty in using soldering irons to remove or replace such devices. To help overcome these difficulties, Thermaltronics, a manufacturer of soldering systems using the unique “Curie Point” Technology, has released a new, digital hot air pencil with adjustable controls for air and temperature.     
Read More

FRAMOS: ON Semiconductor Releases the First Two Devices in the New X-Class CMOS Image Sensor Platform, Enabling High Performance with Small Footprint Integration

OTTAWA, CANADA - The XGS 12000 and XGS 8000 devices in the new X-Class CMOS image sensor platform from ON Semiconductor provide 12.6 megapixel and 8.8 megapixel (4k UHD) global shutter imaging for machine vision, ITS, and, broadcast applications.     
Read More

ISRA announces a new generation of bin picking: Quad-camera technology provides extremely short scanning times for every type of component and container

Multi-stereo sensor with 3D point cloud technology enables record times for bin picking

DARMSTADT, GERMANY - A new illumination process and powerful quad-camera technology helps bin picking reach new top speeds. Any component shape and any container type is now scanned in significantly less than one second.     
Read More

Two Industry Awards for Viscom’s high-speed 3D AXI 7056-II at Nepcon China

SHANGHAI - Nepcon China – Viscom, a leading German manufacturer of high-quality inspection systems for the electronics industry, is very pleased to announce that their innovative high-speed 3D AXI inspection system X7056-II has been recognized with two significant industry awards at Nepcon China: the 2018 SMT China Vision Award and the EM Innovation Award.     
Read More

TopLine Sees Growing Interest in CCGAs at NEPCON China as PCBA Makers Seek Greater Reliability

IRVINE, CA - TopLine, a world-leading manufacturer and designer of component solutions and test vehicles for SMT/PCB assembly, exhibited at the recent NEPCON China conference and exhibition in Shanghai and noted a number of significant new directions in thinking with regard to component reliability, quality, and thermal management issues.       
Read More

Juki Automation Systems Announces Growth in Mexico

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce that it has seen tremendous growth in Mexico since Rene López joined the company in 2015.    
Read More

Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at PCIM Europe

Booth #7-528

CLINTON, NY - Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at PCIM Europe, June 5-7, in Nuremberg, Germany.

Indium Corporation is redefining solder with its InFORMS® solder preforms. InFORMS® are a composite preform consisting of solder with a reinforcing matrix.     
Read More

MicroVision Delivers LiDAR Sensing Samples with New Time-of-Flight ASICS

REDMOND, WA - MicroVision, Inc., a leader in innovative ultra-miniature projection display and sensing technology, today announced that it has provided product samples for customer evaluation that include the company’s latest time-of-flight ASICS. These new ASICS have specialized circuitry that enables MicroVision’s MEMS scanners to be used as LiDAR sensors.     
Read More

Alexander Gerfer appointed to PSMA Board of Directors: CTO of Würth Elektronik eiSos group boosts PSMA Management

WALDENBURG, GERMANY - Alexander Gerfer, CTO of Würth Elektronik eiSos Group, has been appointed to the twelve-strong Board of Directors of the Power Sources Manufacturers Association PSMA. The international association for power electronics has set itself the goal of increasing and propagating knowledge about technologies and developments in the context of energy sources and the transformation of energy.    

Read More

Thermaltronics Introduces the TMT-FE100S Benchtop Fume Extraction System

NEW YORK - Thermaltronics, a fast-growing manufacturer of soldering systems and accessories, introduces a new versatile, benchtop fume extraction system.

The unit, which is certified to TUV NRTL and TUVE CE safety standards, is available in both 110V and 220V versions and unlike most other benchtop units, has an adjustable speed control to allow operators to select the best operating speed, dependent on fume conditions.     

Read More

PATLITE Announces a New Work Light Designed to Efficiently Illuminate Workspaces

The CWF LED Work Light

TORRANCE, CA - PATLITE (U.S.A.) Corporation, a leading provider of innovative LED signal lights, sounders, and network-enabled alerts announces a new product release. The CWF, an industrial-grade LED work light designed to efficiently illuminate workstations, machinery, and control cabinets.    
Read More

SMT Hybrid Packaging 2018 – Innovative Exhibition and Conference provides platform for personal exchange

The SMT Hybrid Packaging will soon be taking place at the Nuremberg exhibition center inviting exhibitors, participants of the conference and visitors to greatly benefit from intensifying personal contacts and the exchange of information available on site.

Read More

Quadruple Industry Recognition for Nordson DAGE Test and Inspection systems at Nepcon China 2018

Aylesbury, Buckinghamshire, UK - Nordson DAGE announces that it was recognized with four awards for its Test and Inspection systems during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.    
Read More
search login