Friday, July 29, 2016
HOME / CURRENT ISSUE >  Daily News Archive > 
Engineered Material Systems to Showcase Adhesives for Stringing and Shingling Next-Generation Solar Modules at Intersolar North America
Publication Date: 7/7/2016

DELAWARE, OH Engineered Material Systems, Inc. (EMS), a leading global supplier of conductive interconnect materials for photovoltaic applications, will exhibit its new 561-400 series Low-Cost Snap Cure Conductive Adhesives at Intersolar North America, scheduled to take place July 12-14 in San Francisco, CA. The 561-400 series is designed for stringing and shingling crystalline silicon and heterojunction solar modules. 

Kolb Cleaning Technology intros new Concentrate Multi-purpose detergent - MultiEx VRSP-CN
Publication Date: 7/7/2016

LONGMONT, CO - Kolb Cleaning Technology has just released a new concentrated cleaning detergent, MultiEx® VRSP-CN. The Kolb MultiEx VRSP-CN is an aqueous, alkaline broadband, multifunctional detergent well suited for multiple cleaning tasks including PCBs, stencils, solder carriers and frames, and production tools.
Ersa Delivers Quality Selective Soldering in a Small Footprint
Publication Date: 7/7/2016

PLYMOUTH, WIKurtz Ersa North America, a leading supplier of electronics production equipment, is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, Aug. 4, 2016 at the Embassy Suites Cleveland Rockside in Cleveland, OH. Ersa’s team will showcase the Smartflow 2020.

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste At Semicon West 2016 Booth # 6467 in San Francisco
Publication Date: 7/7/2016

SAN JOSE, CA - SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.

Mitch Holtzer of Alpha to Present on Ionic Contamination and SIR Testing at Upcoming SMTA Ohio Expo & Tech Forum
Publication Date: 7/6/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, is participating in the upcoming SMTA Ohio Expo & Tech Forum on August 4th in Cleveland, Ohio as both an exhibitor and technical presenter.

KIC: Find Out How to Reduce Production Costs at SMTA Chihuahua
Publication Date: 7/6/2016

SAN DIEGO, CA - KIC today announced that it will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, July 14 at the Casa Grande Hotel in Chihuahua, Mexico. Miguel Carbajal, KIC’s Sales Manager in Mexico, will be available to discuss KIC’s smart oven technologies.
OKW: New DIN Rail Enclosures With Integrated Terminal Blocks
Publication Date: 7/6/2016

BRIDGEVILLE, PA - OKW has extended its RAILTEC C DIN rail enclosures range with a new CV version that features four integrated terminal blocks.

New RAILTEC CV can be specified for a wide range of applications including automation, building technology, safety systems and HVAC – notably time controllers, sensors, relays, signal distributors and lighting controls.

STI Receives Prime Contract Award for SeaPort-e
Publication Date: 7/6/2016

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce that it has received a prime contract award for SeaPort-e.
Digi-Key Daily | Microchip Xpress Dev Board
Publication Date: 7/5/2016

Microchip has moved their well known MPLAB IDE to the cloud as the simplified MPLAB XPress and the MPLAB XPress Development board provides the perfect environment to explore this simplified IDE. With a library of Microchip-validated code to pull from, designers can get a head start on creating a wide range of custom applications. The MPLAB Xpress requires no downloads, software or drivers to get started, and allows users to compile their code in the cloud for free. The development board is based around the 28 pin PIC16F18855 8-bit microcontroller, has all pins broken out, features LEDs, a pushbutton switch, potentiometer and is connected to the computer via USB.
ULT Now Provides Effective and Variable Removal of Odours, Gases and Vapours – with Explosion Protection
Publication Date: 7/5/2016

Loebau, Germany - ULT AG provides its extraction and filtration system the ACD 1200 in various models for a wide range of applications. A variety of filtration packages is available for tasks such as bonding, varnishing, laminating, printing, cleaning or moulding. Dependent upon the extraction capacity required, the unit might feature different vacuum modules.   
Juki Announces SPI to Screen Printer Closed-Loop Package
Publication Date: 7/5/2016

MORRISVILLE, NC - Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, is pleased to announce its Special SPI to Screen Printer Bundle Closed Loop Package. The package includes the state-of-the-art GL Plus Screen Printer coupled with the CyberOptics SE500-II. The closed-loop package increases first-pass yields by automatically correcting the x-y registration on the screen printer with measurements off of the SPI.

U.S.Tech Publisher’s Choice: July 2016
Publication Date: 7/5/2016

This month, our publisher’s choice is a piece written by Peter van den Eijnden, managing director of JTAG Technologies, on the development of JTAG/boundary-scan from birth to its current success as an alternate test method to in-circuit testing (ICT). He traces the roots of the technology to the mid-1980s and discusses its growth as well as the standards it has been built upon.
Avnet Appoints Steve Gomez New Vice President of Sales in the Americas
Publication Date: 7/5/2016

PHOENIX, AZ —Avnet, Inc. (NYSE: AVT), a leading global technology distributor, today announced the promotion of Steve Gomez to senior vice president of sales, Avnet Electronics Marketing Americas, effective immediately. Most recently, Gomez served as vice president, area director of the West and Latin America areas within the region.
PACE Worldwide Moves to Permanent Corporate Headquarters
Publication Date: 7/5/2016

VASS, NC - PACE Worldwide is pleased to announce the move of our primary manufacturing location in Southern Pines NC to our new home about 5 minutes away in Vass NC. After 9 years of leasing the Southern Pines facility, PACE has decided to purchase a permanent home, which will serve as Corporate Headquarters.
Mycronic Receives Order for an Advanced Prexision-80 Mask Writer
Publication Date: 7/1/2016

TAUBY, SWEDEN - Mycronic AB (publ), has received an order for a Prexision-80 (P-80) mask writer for advanced display applications from a customer in Asia. The system is scheduled to be delivered around year-end 2017.

Mycronic offers mask writers for manufacturing of photomasks within different fields of application. These areas are display manufacturing (for TV, smart phones and tablets among other things) and applications within the multi-purpose market.
Successful ASM Roadshow in Manaus
Publication Date: 7/1/2016

MANAUS, BRAZIL - ASM Assembly Systems with their Partners Easy have just completed another roadshow in Manaus, Brazil. The event was hosted in the facility of EASY, an ASM partner in the city of Manaus. EASY and ASM provide sales, service, applications and spare parts support from this building for SIPLACE and DEK customers in the Manaus area.
Ventec International Group announces ISO 9001:2015 certification for its German Facility
Publication Date: 7/1/2016

KIRCHHEIMBOLANDEN, GERMANY - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, is proud to announce that its Central European facility located in Kirchheimbolanden, Germany has received certification under the ISO 9001:2015 quality management standard.
Mercury Systems Receives $7.9M Order for Integrated Microwave Assemblies for Unmanned Airborne Electronic Warfare Jamming Application
Publication Date: 7/1/2016

CHELMSFORD, MA - Mercury Systems, Inc. (NASDAQ:MRCY) (, announced it received a $7.9 million follow-on order from a leading defense prime contractor for integrated microwave assemblies (IMAs) for an unmanned electronic warfare (EW) jamming application. The order was booked in the Company’s fiscal 2016 fourth quarter and is expected to be shipped over the next several quarters.
Avnet Receives Semiconductor Distributor of the Year Award from Vishay
Publication Date: 6/30/2016

PHOENIX, AZ - Avnet, Inc. (NYSE: AVT), a leading global technology distributor, recently received the Distributor of the Year for Semiconductor Products in the Americas from Vishay Intertechnology, Inc. The award was based on sales records for the fiscal year ending March 31. This is the second time in five years that Avnet’s superior sales performance has earned it Distributor of the Year honors from Vishay.
Sono-Tek Corporation to Introduce Game-Changing Photoresist Ultrasonic Coating System at SEMICON West
Publication Date: 6/30/2016

MILTON, NY - Sono-Tek Corporation (OTC BB: SOTK) today announced plans to unveil a new photoresist ultrasonic coating system in Booth #2146 at SEMICON West, scheduled to take place July 12-14th at the Moscone Center in San Francisco, CA. The new photoresist coating system, SPT200, has been designed specifically to meet the unique challenges of coating high aspect ratios and deep well topographies such as MEMS wafers with photoresist.
search login