Sunday, January 22, 2017
VOLUME -22 NUMBER 10
Publication Date: 10/1/2007
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Innovative Machine Technology: SEHO Ensures Higher Productivity at APEX
Publication Date: 1/10/2017

ERLANGER, KY - SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight a full line of market leading selective soldering and wave soldering systems in Booth #2309 at the IPC APEX EXPO, scheduled to take place Feb. 14 – 16, 2017 at the San Diego Convention Center.
 
Ventec’s Martin Cotton to unveil industry's most advanced Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
Publication Date: 1/10/2017

Fullerton, CA - Ventec International will be participating at DesignCon 2017, the premier conference for chip, board, and systems design engineers, on booth #118 and has specifically chosen the event as the ideal platform to unveil the industry's latest advances in PCB materials for high-speed low-loss applications. Ventec's Martin Cotton (Director - OEM Technology Marketing) and Bill Wang (Technical Director) will be presenting their paper titled "Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications" in Ballroom F on Wednesday, 1st February at 8:00am.

Scienscope to Demo Its X-ray Product Line at APEX
Publication Date: 1/9/2017

Chino, CAScienscope International, a complete inspection solutions provider, will exhibit in Booth #1331 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif.  Company representatives will be available for live demonstrations of Scienscope’s various PCB X-ray inspection systems and X-ray Component Counter.

Pillarhouse International Has Another Record Year
Publication Date: 1/9/2017

Chelmsford, Essex, UK – 09 January 2017 – Pillarhouse International Ltd today announced 2016 has once again proved that Pillarhouse continues to lead the way in the Selective Soldering sector of the electronics assembly market. Year-end figures show yet another year-on-year increase in shipped equipment with 2016 being a record year. A 10% increase on 2015.
New SAWA Ultrasonic Squeegee Cleaner Presents New Solution for Lead-Free Pastes
Publication Date: 1/9/2017

TORRANCE, CASeika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the new SAWA SC-145GAE Ultrasonic Squeegee Cleaner. The system presents a new solution for lead-free solder pastes for squeegees as well as other tools such as scrapers, spatulas and misprinted PCBs.

Midwest Contract Manufacturer Computrol to Debut New Test Capabilities at MD&M West
Publication Date: 1/9/2017

MERIDIAN, IDAHOComputrol, Inc., a provider of mid- to low-volume, high-mix electronic manufacturing services to OEMs, announced plans to exhibit in Booth #524 at MD&M West, scheduled to take place Feb. 7-9, 2017 at the Anaheim Convention Center in CA. Computrol is certified to ISO 9001-2008, ISO 13485 specific to medical device quality systems, AS9100 specific to military and aerospace quality systems, IPC class II and III and J-STD certified as well as being ITAR registered and lead-free RoHS compliant. 

Report from Philip Stoten: Start-ups Abound at CES 2017's Eureka Park
Publication Date: 1/6/2017

A report from the Eureka park section of CES 2017. Phil Stoten interviews some of the cutting edge innovators looking for venture capital funding.
Versum Materials™ reaches milestone with installation of 200th CHEMGUARD® Gen. III Refill System
Publication Date: 1/6/2017

Tempe, Az – The Delivery Systems and Services Group (DS&S) of Versum Materials, Inc. has realized an important milestone: the sale and commissioning of its 200th CHEMGUARD® Gen III high purity, liquid delivery system since the product line launched in early 2016. The 200 units are now running in the latest high-volume semiconductor fabs globally.
New Multi-Axis SiP Alignment Systems for Test & Production; From PI's Award-Winning Technology
Publication Date: 1/6/2017

Auburn, MA – Nanopositioning equipment manufacturer PI now offers a new family of auto-mated alignment engines for silicon photonics applications including 3 to 6 axis mechanisms, controllers with firmware based alignment algorithms, and the software tools to meet the high accuracy demands of different markets, such as packing, planar testing, or inspection.

VERTICAL CONVEYOR OVEN FROM GRIEVE
Publication Date: 1/6/2017

Round Lake, IL - The No. 906 is an electrically-heated vertical conveyor oven from Grieve, currently used for heating aluminum-clad automotive modules at a customer’s facility.  This oven has a maximum operating temperature of 250°F and overall workspace dimensions measuring 36”W x 38”D x 92”H.
New Vishay Semiconductor Hybrid SSRs Distributed Through New Yorker Electronics
Publication Date: 1/6/2017

NORTHVALE, NJ – New Yorker Electronics is now distributing the Vishay Semiconductor Hybrid Solid-State Relays (SSRs) in the new VOR1121A6, VOR1121B6, VOR2121A8 and VOR2121B8 relay models. Vishay’s newest additions to its VOR family of hybrid SSRs are designed to deliver superior electrical characteristics for telecommunications, industrial, security system and metering applications. Compared to similar solutions, the new Vishay Semiconductors 1 Form A VORs provide faster operation with TON 0.20ms and TOFF 0.03ms, a wide temperature range of -40°C to +100°C and a higher load voltage of 250V.
Live Report from Philip Stoten: 2017 CES Opens in Las Vegas
Publication Date: 1/5/2017

Philip Stoten reports from the floor at the opening of the 50th anniversary CES in Las Vegas. Phil highlights some of the more interesting technology start-ups exhibiting this year.
EMS: New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Publication Date: 1/5/2017

DELAWARE, OH - Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Guylaine Guerette Joins MicroCare
Publication Date: 1/5/2017

NEW BRITAIN, CT - MicroCare is pleased to announce that Ms. Guylaine Guerette has joined the MicroCare management team in the newly created position of Senior Marketing Manager.

Ms. Guerette has spent eighteen years in marketing at Brady Corporation (Branford, CT). At that company, she managed multi-channel marketing programs and led the deployment of sophisticated marketing campaigns for various Brady Workplace Safety sub-brands.
 
Universal Instruments and Cogiscan join forces to provide Factory-Wide Traceability & Connectivity
Publication Date: 1/5/2017

BROMONT, CANADA - Cogiscan Inc., the leading Track, Trace and Control (TTC) solutions provider for the electronics manufacturing industry, announced that it was chosen by Universal Instruments to support traceability and connectivity requirements for one of its major customers.
 
New representative for Rehm Thermal Systems
Publication Date: 1/5/2017

BLAUBEUREN, GERMANY - Exmore is taking care of Rehm products in Belgium, the Netherlands and Luxemburg as of 1st January 2017. With Exmore, our customers in the Benelux have immediately a direct contact person in all matters relating to sales, service or spare parts management of the complete product portfolio of Rehm.
Ironwood Electronics: 75GHz Clamshell Socket for NXP's BGA141
Publication Date: 1/5/2017

EAGAN, MN - Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2061 socket is designed for 10x10 mm package size and operates at bandwidths up to 75GHz with less than 1dB of insertion loss.
Bosch Connected Devices and Solutions showcases sensor solutions for connected mobility, Industry 4.0 and logistics
Publication Date: 1/5/2017

REUTLINGEN, GERMANY - Bosch Connected Devices and Solutions showcases three innovative sensor-based solutions at the 2017 International CES in Las Vegas, USA. The devices help improve comfort, convenience and accountability, and new extension boards simplify the development of Internet of Things (IoT) applications.
FLIR Launches Five New Thermal Cameras at CES 2017: Third Generation FLIR ONEs, FLIR Duo Thermal/Visible Drone Cameras, and FLIR C3 Rugged Pro Camera
Publication Date: 1/4/2017

WILSONVILLE, OR - FLIR Systems, Inc. announced today the launch of five new thermal imaging cameras at the 2017 Consumer Electronics Show (CES), including two new third generation FLIR ONE thermal camera attachments for smartphones, two new dual sensor thermal cameras for drones, and a ruggedized compact thermal camera for home and building inspectors. All five products feature FLIR Lepton®, FLIR’s revolutionary thermal microcamera core, and FLIR’s patented multispectral dynamic imaging (MSX®) technology, which dramatically improves image quality and readability by dynamically embossing high-fidelity, visible-light details onto the thermal imagery.
Akrometrix Announces First Shipment of FOWLP Panel Warpage Metrology System
Publication Date: 1/4/2017

ATLANTA, GA - Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, today announced the shipment of its first warpage metrology system specifically designed for FOWLP Panel applications – the AKM600P – to a key customer in Asia.
 
 
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