Wednesday, August 24, 2016
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U.S.Tech Publisher's Choice August 2016
Publication Date: 8/12/2016

This month, our publisher's choice article is a piece by Lior Yosef of Mechanical Devices, Ltd., on the subject of IC temperature testing and the pros and cons of using thermal stream systems vs. direct thermal head systems. Unlike temperature test chambers, these systems test a single device at a time and are not meant to operate continuously for long periods of days or weeks.
SEICA: Preview for Nepcon South China - Shenzhen, Booth 1A52 - August 30- September 01, 2016
Publication Date: 8/12/2016

STRAMBINO, ITALY - The theme for Seica at Nepcon South China this year will be the Pilot line and the traditional Compact line of bed of nails and functional testers integrated with Industry 4.0 concept. The Compact and Pilot lines have all of the capabilities needed for implementation in any Factory 4.0 scenario, providing the possibility to plug in any proprietary or third party information system to achieve the desired goals.
Würth Elektronik eiSos is the host of the Wireless Power Consortium
Publication Date: 8/11/2016

WALDENBURG, GERMANY - The Wireless Power Consortium is the leading standardisation body for wireless energy transfer. Würth Elektronik eiSos is organising the European Meeting of the WPC from 22 to 25 August at the Hotel Hilton Munich City, and will play a key role in the "Wireless Power Trade Show and Seminar" on August 25.
JTAG Technologies: Press Preview for SMTA
Publication Date: 8/11/2016

EINDHOVEN, THE NETHERLANDS - JTAG Technologies return to SMTA in 2016 to premiere several new hardware products for PCB testing and In-System [Device] Programming.

As one of the World’s leading supplier of JTAG-powered testers and device programming tools JTAG Technologies will be displaying much of its current hardware range and will also offer live software demonstrations.
Nordson DAGE Announce European Distributor Network Changes
Publication Date: 8/10/2016

AYLESBURY, UNITED KINGDOM - Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces changes to its European Distributor network for X-ray products. Effectively immediately, the following distributors are appointed as full-service distributors for all sales and support tasks within their respective territories:
YXLON International: Product Note - ASTM E2973
Publication Date: 8/10/2016

HAMBURG, GERMANY - As a new option, YXLON now also provides the ASTM E2973 Digital Reference Images for Aluminum and Magnesium Die Castings in its imaging software Image2500 and Image3500 of X-ray inspection systems including Y.MU2000-D and MU60 AE.
PDR Americas Appoints New National Account Manager
Publication Date: 8/10/2016

SHINGLE SPRINGS, CA - PDR Americas, a leader in IR rework, announced today that Dan Kelsey has joined the company as the National Sales Manager of the Infrared Rework division. Mr. Kelsey brings more than 35 years’ experience in direct sales, sales management, marketing and corporate management of technical products. He joins PDR having most recently served as general manager of Scienscope International.
HumiSeal? attending Productronica India with a range of conformal coatings for all market sectors now being made in India
Publication Date: 8/10/2016

WESTWOOD, MA - HumiSeal®, a leading manufacturer and distributor of conformal coatings has announced that it will use the Productronica India 2016 event in Bangalore, 21st – 23rd September 2016, as a platform to showcase its extensive range of conformal coatings as well as to solidify its recent expansion into India following the announcement of its sales, support and manufacturing facility in Pune. Visitors to the HumiSeal stand (3251) will be able to hear first-hand just how far conformal coatings have come as HumiSeal continues to set the benchmark in conformal coatings.
Kaynes Technology Implements Lean NPI Flow using Mentor Graphics Software
Publication Date: 8/10/2016

WILSONVILLE, OR - Mentor Graphics Corporation (NASDAQ: MENT) today announced that Kaynes Technology, a leading electronic manufacturing service (EMS) company based in Mysore, India, has selected Mentor Graphics to provide a complete design-to-manufacturing solution comprising Mentor Graphics Xpedition® Enterprise, HyperLynx®, Valor® Process Preparation, Valor NPI and Valor Parts Library products.
Special Incentives for Online Equipment Purchases at MANNCORP.COM
Publication Date: 8/9/2016

HUNTINGDON VALLEY, PA - Online purchasing of equipment for SMT and through-hole assembly at is now easier and more advantageous than ever with the implementation of automatic discounts and flat-rate shipping.

Manncorp customers who purchase any piece of equipment through the company’s advanced e-commerce website will now automatically receive discounts of at least 5% as items are added to their shopping cart.
August Issue Goes to Press as U.S.Tech Preps for Fall
Publication Date: 8/9/2016

As the August edition of U.S.Tech goes to print this week, we look ahead to a busy and exciting Fall season. This month, the paper is focused on NEPCON South China in Shenzhen, which we expect to be an outstanding show. We are also hard at work preparing a tremendous September issue with a focus on PCB and Test that will travel to major trade shows including IMAPS and SMTA International.
TTM Technologies, Inc. to Exhibit at the EV Tech Expo in Novi, Michigan
Publication Date: 8/9/2016

COSTA MESA, CA - (GLOBE NEWSWIRE) -- TTM Technologies, Inc. (Nasdaq:TTMI), a global leader in printed circuit board (PCB) manufacturing, is thrilled to showcase its PCB and Electronic Manufacturing Solutions to electric and hybrid automotive suppliers and OEMs at the EV Tech Expo in Novi, Michigan in September, 2016. Currently, TTM serves a number of tier one suppliers and automotive manufacturers with high reliability solutions, from prototype to high volume production, supported by a global network of experienced engineers.
NXP Announces Launch of Senior Unsecured Notes Offering
Publication Date: 8/9/2016

EINDHOVEN, THE NETHERLANDS - (GLOBAL NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI) (together with its subsidiaries, “NXP”) announced today that its subsidiaries NXP B.V. and NXP Funding LLC intend to offer an aggregate principal amount of $1,000 million of senior unsecured notes due 2022 (the “Notes”) pursuant to Rule 144A and Regulation S under the U.S. Securities Act of 1933, as amended (the “Securities Act”).
Indium Corporation Receives ON Semiconductor Award for “Perfect Quality” in 2015
Publication Date: 8/9/2016

CLINTON, NY - Indium Corporation has been recognized by ON Semiconductor for “perfect” quality in 2015.

The Annual Perfect Quality Award was presented to Ross Berntson, Indium Corporation Executive Vice President, at ON Semiconductor’s Supplier Executive Conference on June 8, in Phoenix, Ariz.
STI Acquires New High-Speed Flexible Mounter from Juki Automation Systems
Publication Date: 8/9/2016

MADISON, AL - STI Electronics, Inc., a full service organization providing training services, training materials, analytical/failure analysis, prototyping, and small-to-medium volume contract PCB assembly, is pleased to announce the acquisition of a new Juki KE-3020VA High-Speed Flexible Mounter.

This new placement system provides STI’s Contract Assembly Services with a significant improvement to its capabilities.
Saline Lectronics Purchased the Stinger Dispensing Add on for PCBs Exposed to Critical Environments
Publication Date: 8/9/2016

SALINE, MI - Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.
Digi-Key: SparkFun SEN-12670 Breakout Board
Publication Date: 8/8/2016

Schleuniger, Inc. to Exhibit Wire Processing Solutions at The Assembly Show
Publication Date: 8/8/2016

MANCHESTER, NH - Schleuniger, Inc., a leading international manufacturer of high-precision wire processing machines, will be exhibiting at The Assembly Show, an assembly focused trade show aimed at helping suppliers, buyers and users of assembly equipment in manufacturing plants connect, learn, share and explore all things assembly. This exclusive showcase will be held October 25-27, 2016 at the Donald E. Stevens Convention Center in Rosemont, IL.
Alpha To Present Technical Papers on Reliability at SMTA China South Technical Conference in Shenzhen
Publication Date: 8/8/2016

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering materials, will be presenting two technical papers titled “Thermal and Mechanical Reliability of Low-Temperature Solder Alloys for Handheld Devices” and “High Reliability Interconnects for High Power LED Assembly” at SMTA China South Technical Conference on August 31, 2016.
Dymax Introduces BlueWave? MX-150? LED Spot-Curing System
Publication Date: 8/8/2016

TORRINGTON, CT - Dymax Corporation introduced the BlueWave® MX-150™ - a new smaller LED spot-curing system with unique curing flexibility. The system can be used as a bench-top unit or integrated into an automated system, and its LED emitters are available in 365, 385, or 405 nm wavelengths.
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