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Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West
Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder in Booth #4626 at the upcoming SPIE Photonics West exhibition, scheduled for February 5-7, 2013 at the Moscone Center in San Francisco, CA.

The semi-automated configuration of the FINEPLACER® Lambda, which will be exhibited at the show, provides automated die placement and controlled bonding after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process reproducibility, placement of die with dimensions that exceed the optical field of view, and up to 10 programmable alignment positions. Options are available for inert atmosphere, forming gas and high force (500N).

The FINEPLACER® Lambda handles a variety of processes, including Indium or Au/Sn soldering with environmental atmosphere, thermo compression/thermo-ultrasonic bonding, and adhesive dispense technologies. Applications include flip chip, 3-D packaging, MEMS, wafer-level packaging (C2W), optoelectronic/micro optics bonding and assembly, sensors, and more. The process flexibility of this system makes it ideal for prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding accuracy.

For more information, visit Finetech in Booth #4626 at the show or on the Web at www.finetechusa.com.

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