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Quality AOI and SPI Inspection Solutions from CyberOptics on Display at INTERNEPCON Japan
MINNEAPOLIS, MN - The QX100™ AOI system redefines tabletop inspection by combining the performance of an in-line inspection system with the flexibility of a tabletop system
CyberOptics Corporation announces that it will present its newest range of SPI and AOI inspection solutions in booth 52-9 at the upcoming INTERNEPCON Japan, scheduled to take place January 16-18, 2013 at the Tokyo Big Sight in Japan.

The QX100™ AOI system redefines tabletop inspection by combining the performance of an in-line inspection system with the flexibility of a tabletop system. The system features CyberOptics’ unique image acquisition technology, the SIM, and is capable of inspecting component sizes down to 01005. The sleek QX100™ is powered by AI2 (Autonomous Image Interpretation), a next-generation image analysis technique. With AI2, programming gets faster – with a dramatic 90 percent reduction in examples, and simpler – with full support for unsupervised and semi-automatic model training, helping you setup models effortlessly. Inspection programs created on QX100™ can be directly transferred to our in-line AOI systems (QX600, QX100i).

The QX600 AOI System comes with an all-new Strobed Inspection Module (SIM) with enhanced illumination using LED lighting. The new SIM significantly improves solder joint and gold finger inspection while dramatically reducing reflection and shadow effects. The SIM is engineered to be absolutely calibration-free and illuminates only when necessary, reducing cost of ownership. As illumination needs differ for various component types, we design our systems with flexible illumination providing a combination of lighting contrasts to suit different inspection types. A higher sensor resolution (12µm) captures brilliant and crisp quality images for defect review analysis while improving 01005 inspection. Plus, we are still the fastest at a blazing inspection speed of 200cm2/sec.

The SE500ULTRA™ system is power-packed with 30% more speed, revamped defect review software and optional dual illumination sensor. An all-new, improved ultra-fast sensor combined with a unique ‘all-in-one’ scan technique (that integrates fiducial, barcode and range scans into one, seamless inspection scan sequence) is what makes the SE500ULTRA 30% faster at 210cm2/sec. The optional Dual Illumination sensor further enhances repeatability and reproducibility on the very smallest of paste deposits. The SE500ULTRA™ is closed loop feedback ready, which means, better yields too!

Also on display, will be a prototype version of the QX100i system – an entry-level inline AOI system aimed at providing a cost-effective inspection solution.

Perfectly complementing our great line-up of inspection products is CyberConnect™, your best tool for correlating defects between AOI and SPI systems. Integrated within our SPC software, this feature gets you all the “right” data and displays them in just the “right” way for effective defect traceability. Correlating helps you pin-point exactly what went wrong and take corrective action reducing rework costs and improving overall line yield. All this simply means quicker turnaround and enhanced product quality.

The CyberOptics team looks forward to welcoming visitors at booth 52-9 during the INTERNEPCON Japan. For more information, please visit

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