Save. Share. Connect.
Tuesday, September 27, 2016
VOLUME - NUMBER
Daily News Archive
Front Page Articles
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Daily News Archive
Add Message Board
Engineered Conductive Materials Introduces Low-Cost, Flexible Conductive Adhesive CA-141
DELAWARE, OH ― December 2012 ―
Engineered Conductive Materials, a leading global supplier of conductive interconnect materials for photovoltaic applications, introduces the fast curing CA-141 Conductive Adhesive for stringing and bussing next-generation CIGS solar modules. This material formulation has been optimized for excellent conductivity and stability on molybdenum and other substrates used in thin-film manufacturing.
CA-141 is low-cost ECA designed for thermal cycling and damp heat stability on molybdenum and other substrates used in the CIGS manufacturing process. The low Tg of CA-141 is suitable for manufacturing flexible modules using reel-to-reel manufacturing. The material can be partially cured for 60 to 90 seconds, providing enough “green strength” to withstand induced stresses from the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. CA-141 has optimized rheology for dispensing, excellent damp heat resistance and conductivity stability on molybdenum, tin, tin-silver and silver-plated ribbons.
CA-141 is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.
For more information about the CA-141 Conductive Adhesive or to learn how Engineered Conductive Materials can define, develop and create an engineered material solution that is right for your company, visit www.conductives.com.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM