Save. Share. Connect.
Monday, February 20, 2017
VOLUME - NUMBER
Daily News Archive
Front Page Articles
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Daily News Archive
Add Message Board
Molex Introduces LGA 2011-0 CPU Socket Supporting Top-of-the-Line Intel Core* i7 Series Processors
LISLE, IL -
has augmented its CPU solutions with the launch of an Intel-approved
CPU socket for the Intel Core* i7 series of 32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design Power (TDP), the
LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X processors.
"The new LGA 2011-0 socket delivers the improved electrical, mechanical and thermal reliability needed to achieve target performance levels of Intel Core i7-3930K, i7-3820 and i7-3960K Extreme Edition processors used in enterprise servers, workstations and high-end PCs," states Carol Liang, global product manager, Molex. "A higher pin-count and the greater contact density of the compact LGA 2011 socket make it ideal to support the condensed package-and powerful features of Intel 2nd generation, top-of-the-line Core i7 series processors in breakthrough performance applications."
An innovative fully-loaded interstitial seating plane (ISP) design improves contact reliability of the Molex LGA 2011-0 socket by preventing circuit opens and shorts caused by contact deformation during a package overload. The LGA 2011-0 socket is compatible with a Standard (Square) and a Narrow ILM design assembly. The Standard ILM has a larger (80x80mm) keep-out zone than the Narrow ILM (56x94mm). The LGA 2011-0 socket is not backward compatible for use with any other processors and their ILM assemblies.
"The unique ISP design of the LGA 2011-0 socket minimizes risk of electrical shorting during processor overloads-protecting the investment of users who depend on higher system and operation reliability," adds Liang.
The LGA 2011-0 CPU socket uses high strength, copper alloy contacts for robust performance. Socket terminals are oriented at angles that reduce the risk of cross-contact during processor overloads. Molex also offers 15 or 30 micron gold-plated contact sockets with pick-and-place covers for easy placement in automated board assembly. All sockets are shipped in JEDEC-type hard trays.
For additional information visit:
To receive information on other Molex products and industry solutions, please sign up for our
e-nouncement newsletter at
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM