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Koh Young Announces Sale of 4000th Inspection System
SEOUL, South Korea –
Koh Young Technology announces the delivery of their 4000th 3D in-line Inspection (SPI) system to Magic LCD, located in Guangzhou, China. The system sold was a Koh Young Zenith 3D AOI system.
Magic LCD is a leading provider of parts manufacturing services for TFT-LCD and LED BLU (Back Light Unit) in Korea. Magic LCD operates 10 factories and branch offices in Korea and China, employing 1500 workers. All of Magic LCD’s customers are global-leading FPD (Flat Panel Display) companies.
Sung-woo Park, President of Guangzhou Jingnan Electronics in China (Magic LCD), said, “Our team is extremely focused on continuous process improvement and world class quality. We chose the Koh Young Zenith 3D AOI for its superior technology and data analysis software, which we believe will result in improved productivity, reduced workforce, increased quality, and ultimately, trust from our customers.”
In making the announcement, Dr. Kwangill Koh, CEO of Koh Young, said “The delivery of our 4000th in-line System is a significant milestone for Koh Young Technology. We are honored to have Magic LCD deploy our Zenith systems to optimize their electronics manufacturing process. My thanks go out to the entire Koh Young family whose dedication, perseverance, and commitment to excellence and customer satisfaction have made this possible.”
The Zenith 3D AOI system measures the true profilometric shape of components, solder joints, patterns and even foreign material on assembled PCBs with patented 3-dimensional measurement, overcoming the shortcomings and vulnerabilities of traditional 2D AOI. Zenith uses 2D and 3D information for better visualization of the components and solder joints. This ability allows a true comparison with the IPC-A-610 standard for inspection. Thus, the acceptability of the solder joint is without question. Zenith is the first true 3D AOI system ever developed.
Zenith identifies and flags all defects, allowing no escapes, thus serving as a powerful process optimization and quality assurance tool. It also provides 3-D PCB warp compensation with multi-frequency height measurement technology, which ensures uninterrupted real-time inspection of warped boards and compensation with respect to the ideal plane. It features a proven SPC package, which can forecast possible process problems, and is easily integrated into an automated line.
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