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New Webinar Explores SMT Stencil Aperture Size and its Relationship with Solder Paste Volume
LPKF Laser & Electronics has announced it will present the webinar Stencil Aperture Size and Its Impact on the Printing Process Thursday, December 6, 2012 at 11 a.m. PST. The webinar examines the relationship between stencil aperture size and solder paste volume and how the stencil manufacturing process can influence both. To register, visit

With 60-75% of all board assembly problems stemming from solder paste printing, it is important for stencil buyers to understand how the manufacturing method of a stencil will affect aperture size and, in return, solder paste volume. Cp and Cpk analysis of 16 different SMT stencils serves as basis for the webinar’s findings.

Presented by Ahne Oosterhof, founder of A-Laser, and Shane Stafford, LPKF market development representative, the webinar will run less than an hour in length.

Stencil buyers, stencil manufacturers, production engineers, and printing operators are all encouraged to attend. For more information, visit


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