Sunday, June 26, 2016
VOLUME -27 NUMBER 10
Publication Date: 10/1/2012
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ARCHIVE >  October 2012 Issue >  Hi-Tech Events > 

NEPCON China Set for April
Shanghai, China — The 23rd edition of NEPCON China will take place at the Shanghai World Expo Convention & Exhibition Center April 23-25, 2013. A vivid exposition of current industry hotspots and future trends, NEPCON China 2013, will showcase traditional electronics manufacturing equipment and materials. It will also feature a brand new Electronics Manufacturing Automation Pavilion, in response to exhibitor and visitor demand.

As Asia's largest SMT and electronics manufacturing technology event, NEPCON China has long reflected the health of the country's electronics production equipment and electronics manufacturing industry. Over three days, NEPCON China 2013 will present a comprehensive range of new technologies, products and solutions for the electronics manufacturing and SMT industries. The displays will include SMT technology and equipment, electronics manufacturing and automation equipment, ESD and clean room devices, soldering equipment and materials, test and measurement machines, bar code equipment and materials, and electronics manufacturing services. The expo will occupy a massive 38,000m2 with more than 500 exhibitors from 22 countries and regions. There will be more than 1,000 electronics production systems, test and measurement products, and components. Over 20,000 leading industry practitioners and buyers from various fields are expected to attend. Fuji, Hitachi, Juki, Samsung Techwin, Xunke, Nordson, BTU International, Indium, Agilent, Nordson Dage Electronics, Mirtec, TRI and other top suppliers of SMT, soldering and test/measurement equipment and materials, are already confirmed exhibitors at the event. China's electronics manufacturing industry continues to develop in leaps and bounds and the country has become the world's undisputed electronics manufacturing hub. Greater attention to production costs and efficiency by manufacturers is driving the industry to keep pace with automation trends.

The Electronics Manufacturing Automation Zone at NEPCON China 2013 will provide application solutions for advanced industrial automation technologies and products. It will include robot and motion control equipment, automation equipment and accessories, conveyors, tools, assembly equipment and materials, quality control and laser gears.

The expo is China's only trade and purchasing platform that is focused on automation solutions for electronics manufacturers and electronics manufacturing equipment suppliers.

NEPCON China 2013 will introduce the Advanced Electronics Packaging Zone, a showcase of the latest cutting-edge manufacturing technologies and processes in the industry. These will include semiconductors, LEDs, advanced packaging technologies, assembly devices, testing equipment, and packaging materials. ESD and Clean Room Zones will be other features of the show.

Contact: Reed Exhibitions China, 1-3 Xinyuan South Road, Chaoyang District, Beijing, Ping An International Finance Center A, Floor 15, China 100027 +86-10-5933 9346 fax: +86-10-5933 9333 E-mail: inquiry@reedexpo.com.cn Web:
http://www.reedexpo.com.cn or http://www.nepconchina.com

 
 
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