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Nordson DAGE to Exhibit the XD7600NT Diamond X-ray Inspection System with Revolutionary X-Plane Option at ISTFA
AYLESBURY, BUCKINGHAMSHIRE, UK —
Nordson DAGE, a division of Nordson Corporation, announces it will exhibit in
at the upcoming 38th International Symposium for Testing and Failure Analysis (ISTFA), scheduled to take place November 13-14, 2012 at the Phoenix Convention Center in Arizona.
The Nordson DAGE μCT Inspection Option provides Computerised Tomography (CT) functionality to compliment the 2-D X-ray investigations on Nordson DAGE X-ray inspection systems. It uses the superior, sub-micron feature recognition of 2-D X-ray images that Nordson DAGE X-ray systems always provide to produce the best CT models for 3-D sample analysis, virtual micro-sectioning and internal dimensional measurements. Additionally, the option reduces the number of time-consuming micro-section analyses needed, assisting in identifying where micro-section preparation and investigation must concentrate. The μCT inspection capability is available with a system order or as retro-fit to suit application and workflow needs.
Also featured at the show, the Nordson DAGE XD7600NT Diamond X-ray Inspection System is the ultimate choice for the highest magnification X-ray imaging. The unique Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector, makes this system the choice for the highest performance and highest magnification imaging tasks. The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications.
The Nordson DAGE XD7600NT Diamond now features the revolutionary new X-Plane™ option, which uses a proprietary, patent applied for, tomosynthesis, or CT technique to create 2D X-ray slices in any plane of a printed circuit board assembly (PCBA) without the need to cut the board.
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