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VOLUME -27 NUMBER 10
Publication Date: 10/1/2012
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Special Features: Components and Dist.
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October 2012 Issue
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Quik-Pak Ads 8-Lead SOIC Open-Molded Package
San Diego, CA — Quik-Pak, a division of Delphon Industries has introduced its 8-Lead SOIC (Small Outline Integrated Circuit), the newest addition to the Open-molded Plastic Package (OmPP)
The 0.150-in. (3.8mm) narrow body package is built to JEDEC standard MS-012 and is RoHS compliant. It is Ni/Au plated which is excellent for wire bonding. The 8-Lead SOIC has a standard 0.050-in. (1.27mm) lead pitch and a superior sealing surface for air cavity applications.
The company's OmPP product family includes pre-molded QFN (Quad Flat No-Lead) and SOIC package configurations that are designed to provide a high quality, quick, and cost-effective solution to meet IC packaging and assembly needs. The open-molded packages offer flexibility and are suitable for prototype or production volume applications.
In addition, packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing, die/wire bonding, remolding and marking/branding. Custom assembly services are also offered for flip chip, ceramic packages, chip-on-board, stacked die, MEMS, etc.
Contact: Quik-Pak, 10987 Via Frontera, San Diego, CA 92127
858-674-4676 fax: 858-674-4681 E-mail: firstname.lastname@example.org Web:
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