Friday, April 20, 2018
Publication Date: 10/1/2012
Archive >  October 2012 Issue >  Electronic Mfg. Products > 

Nordson YESTECH: M1m AOI System
Advanced AOI system.
Carlsbad, CA — Nordson YESTECH, a subsidiary of Nordson Corporation has unveiled its latest generation M1m AOI. The system has specific design enhancements to directly address the special inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes. The new AOI system is designed for automated inspection of advanced microelectronics and semiconductor packages, with specific inspection algorithms for: wire bond inspection; high accuracy die placement metrology; surface finish inspection for foreign objects and scratches; epoxy underfill; paste, glues and sealants; material dimensional metrology.

The company's advanced megapixel color technology offers high-speed device inspection with exceptional defect coverage all within a footprint less than 1 sq. meter. The M1m can be put in-line or used off-line with an optional magazine loader/unloader.

Programming is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The unit also provides SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device inspected.

Contact: Nordson YESTECH, 2762 Loker Avenue West, Carlsbad, CA 92010 760-918-8471 fax: 760-918-8472 Web:

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