Wednesday, June 20, 2018
Publication Date: 10/1/2012
Archive >  October 2012 Issue >  Electronic Mfg. Products > 

VisionMaster Intros 3-D SPI System
Solder paste inspection system.
Portland, ME — VisionMaster, Inc. has introduced the M500 Manual 3-D SPI advanced 3-D solder paste inspection (SPI) system. Using what is described as the most advanced VisionMaster software to date, the M500 makes full use of cutting-edge multi-core processors and available GPU (video card) massive parallelism to speed up processing and user-responsiveness.

The unit runs with a single click, automatically recognizing and measuring solder paste in the camera's view. Height and volume readings for each pad are displayed clearly. Just as easily, double-clicking readings add them to the built-in SPC charts. Long life, solid-state LEDs are used for projection and background lighting. In addition, advanced CMOS image sensors are immune to electrical analog noise, resulting in very repeatable measurements.

Like all of the company's equipment, the M500 uses advanced white light Moire interferometry to build height data for every pixel in the view at a fraction of the cost of the competition. VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this sophisticated 3-D algorithm for manual benchtop units.

The M500 requires zero maintenance and is designed to provide years of trouble-free usage. Rugged yet light and portable, the sensor is machined from aircraft grade aluminum and is mounted on a vibration-damping, ESD-resistant granite base. To ensure consistent high quality, more than 95 percent of components are sourced in the U.S.A.

Contact: VisionMaster, Inc., 110 Exchange Street, Suite 300, Portland, ME 04101 207-404-2920 fax: 207-514-7606 E-mail: Web:

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