Sunday, June 17, 2018
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Majelac Technologies LLC Announces New Facility
Majelac Technologies LLC, provider of quick-turn integrated circuit (IC)
assembly, wafer dicing, and packaging services announced its relocation
to a new, advanced and expanded facility today.

The new facility boasts 50% more new, custom, clean manufacturing space
to house the company’s advanced IC packaging, assembly, and dicing operations.

Effective immediately, Majelac Technologies LLC can be found at 3070 McCann Farm Drive, Garnet Valley, PA 19060. This new and expanded
space features electrostatic tile flooring, custom layout to maximize productivity, and a production floor secure from the remainder of the facility.
“We’re thrilled by the opportunities this relocation presents”, says Mike Quinn, President of Majelac Technologies LLC. “The additional space
will let us pursue new services. For example, we’re currently introducing
heavy wire bonding capability. We’re extremely pleased with our new

About Majelac Technologies LLC
The company specializes in providing quick-turn subcontract assembly services to the Semiconductor and Optoelectronics industries; specifically
wafer dicing, die bonding, wire bonding, die sorting, and encapsulation.
Majelac offers a wide variety of packaging sizes and options to suit any
need from medium volume  contracting to small volume prototyping. Additional assembly services offered include code marking, ball grid array
(BGA) reballing, and individual die dicing. Majelac’s unique approach delivers faster time to market combined with an attention to detail that
provides the best possible result for any IC assembly need.

CONTACT: Mike Quinn, President, Majelac Technologies LLC, (610)–
459 – 8786. Visit:

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