Wednesday, May 23, 2018
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TE Connectivity (TE) is featuring a range of next-gen military electronics technologies at this year’s AUSA 2012 Annual Meeting & Exposition, as well as the latest end-to-end solutions from the widest stable of high performance interconnects anywhere in the world. These new high-speed connectivity solutions will be on display at Booth 2707, Hall A-C on October 22-24, in Washington, DC.

The following products and solutions will be featured:
Advanced Composites & Antennas - High performance polymers and composite solutions for harsh, high temperature and corrosive environments that meet critical demands for thermal management, EMI shielding and enhanced SWaP.

CeeLok FAS-T Connector - The most rugged, small form factor, field terminable, I/O connector that meets high-speed 10Gb/s Ethernet performance.
Cold Applied Splice - Designed as a single component in-line splice to provide high environmental protection to seal the termination from moisture and provide electrical isolation.
Deutsch MIL-DTL 38999 Series Connectors - Circular connectors in accordance with MIL-DTL-38999.
Deutsch Wildcat Connectors - Specifically designed for harsh environment applications where space and weight savings are of critical importance.
Expanded Beam Optical Connectors - Rugged optics and fiber optic technology provides a clean transmission path in bandwidth and capacity.
Mezalok Mezzanine Connector - A high-reliability mezzanine connector that more than doubles the speed and durability of competing technology, making it the most viable option for adverse environments.
Power Distribution Panels - HARTMAN AC and DC power distribution units (PDUs) and KILOVAC DC PDUs from TE are designed, built and qualified to meet specific requirements.
RT-555 High Temperature Heat Shrink Tape - A bi-layer, side-entry, heat-recoverable sealing product for wire harness bundles saves time and resources.

For more information on any of these technologies and solutions, contact the Product Information Center at 00+1+800 522 6752 or visit

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