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LPKF to Showcase UV Depaneling System at SMTA International
Tualatin, OR, August 2012 — LPKF Laser & Electronics will exhibit at the upcoming SMTA International Conference and Exposition in booth #417, focusing on UV laser systems for depaneling and processing bare rigid and flexible PCBs. The exhibition takes place October 16-17, 2012, 9 am-5 pm, at the Walt Disney World Dolphin Hotel in Orlando, FL.
Designed for depaneling populated PCBs, the LPKF MicroLine 1120 S and 6120 S are ideal for cutting break-out tabs and complex contours with the highest accuracy. They also cut stress-free board outlines adjacent to delicate components and tracks. The systems demonstrate superiority over conventional methods when processing rigid and flexible substrates, and permit for small subassemblies with higher densities on the edge of the PCB.
Also being highlighted at the show is the MicroLine 1120 P and 6120 P, designed for processing bare rigid and flexible PCBs. The UV laser cuts, drills, engraves and ablates with the tightest tolerances on a wide variety of materials, making it the most versatile and inexpensive UV laser on the market today. It has the ability to cleanly cut complicated patterns with minimal stress to the substrate and allows for more circuits on a single panel.
For more information on these systems, stop by booth #417 at the show or visit www.lpkfusa.com.
LPKF Laser & Electronics is the world leading manufacturer of both mechanical and laser systems for demanding tasks in printed circuit board technology and microelectronics. LPKF’s worldwide headquarters is located in Garbsen, Germany outside of Hannover which maintains North American headquarters in Portland, OR. To learn more about LPKF Laser & Electronics, visit: www.lpkfusa.com.
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