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OK International’s Ed Zamborsky to Present Tips to Reduce Rework Costs during SMTA International
GARDEN GROVE, CA ―   
OK International has announced that its Eastern Regional Sales Manager Ed Zamborsky will present a paper titled “Reduced Cost Methods for Micro Array Rework” at the upcoming SMTA International Conference and Expo, scheduled to take place October 16-17, 2012 at the Walt Disney World Dolphin Hotel in Orlando, FL. The presentation will be held during Session MFX6 titled “Proven Technologies for Next Generation Lead-Free Rework,” which will take place Wednesday, October 17, 2012 from 2-3 p.m. in room Asia 4.


This presentation will provide an introduction to component types as well as the evolution of package sizes and how to rework them using cost effective and high reliability techniques. This course will instruct the attendee on how to correctly identify different types of components and the different rework considerations that must be taken into account when using a specific type of array package. The attendee will then receive instruction on the latest strategies for handling the five main steps of array rework: thermal profiling, removal, site cleaning, site preparation, and replacement. The attendee will then have the opportunity to see live demonstrations of array rework of micro BGA package types on low-cost state-of-the-art equipment.

Zamborsky has been with OK International for more than 20 years since joining the company from Harris/3M. He has published more than 20 articles and white papers on topics including; low-volume SMT assembly, solder fume extraction, SMT rework, BGA rework, lead-free hand soldering, lead-free visual inspection and lead-free array rework. Ed holds a degree from the DeVry Institute of Technology.

For more information about OK International, visit
www.okinternational.com.

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