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AIM to Highlight New NC259 Solder Paste at SMTA International 2012
CRANSTON, RI ― AIM's NC259 solder paste has also proven to eliminate defects such as voiding and head-in-pillow
AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the Walt Disney World Dolphin Hotel in Orlando, FL.

This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. A virtual drop-in for SAC305, AIM’s NC259 was designed specifically for alloys such as SN100C and SAC0307. NC259 offers excellent print definition and consistent solder volume transfer. NC259 has also proven to eliminate defects such as voiding and head-in-pillow as well as reduce graping on ultrafine pads. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.

Additionally, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.

For more information about AIM, visit www.aimsolder.com.

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