Save. Share. Connect.
Monday, September 26, 2016
VOLUME - NUMBER
Daily News Archive
Front Page Articles
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Daily News Archive
Add Message Board
Nihon Superior to Introduce Ultra Low Voiding Solder Paste at SMTA International 2012
OSAKA, Japan —
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce newly developed solder paste for low voiding in soldering processes and materials in
at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the Walt Disney World Dolphin Hotel in Orlando, FL.
SN100C P810 D4 is especially designed for use in vacuum reflow with nitrogen. The high-reliability no-clean lead-free solder paste is optimized to deliver excellent reflow characteristics while reducing voiding. The vacuum reflow process reduces voiding compared to the traditional reflow process; however, SN100C P810 D4 further reduces voiding to less than one percent in measured void area. In developing SN100C P810 D4, Nihon Superior took a new approach to the design of a solder paste that would minimize voiding in the large solder joints that provide a critical thermal path for heat dissipation from power semiconductors. As well as optimizing the balance of low boiling and high boiling solvents, Nihon Superior looked specifically at the effect of the flux medium on the surface tension of the solder. High surface tension inhibits the escape of flux volatiles by limiting the size of the bubble formed by a given amount of volatile material. Formulating the flux system to reduce surface tension, the bubble size is increased and bigger bubbles are more likely to escape than small ones even with the benefit of vacuum reflow.
The likelihood of bubble entrapment is further reduced by the eutectic solidification of the SN100C alloy, now in its 13th year of use in high volume lead-free assembly. In the two-stage non-eutectic solidification of SAC alloys the primary tin dendrites form a network that can block the escape of gas bubbles. SN100C P810 D4 generally can be reflowed with a profile similar to that commonly used with SAC305 and SAC405 with 245°C peak. In the extended time above liquidus (TAL) that some joints in complex high thermal mass assemblies sometimes experience during reflow, the proven very low tendency of the SN100C alloy to dissolve copper from the pad provides an additional reliability benefit.
For more information about Nihon Superior’s new SN100C P810 D4 solder paste and lead-free products, meet company representatives in
at the show or visit the company on the web at
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM