Tuesday, May 31, 2016
VOLUME -27 NUMBER 9
Publication Date: 09/1/2012
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ARCHIVE >  September 2012 Issue >  SMTAI Product Preview > 

Mirtec Intros Advanced AOI Inspection Systems
MV-9 AOI inspection system.
Oxford, CT — Mirtec's MV-9 2D/3D AOI System is configured with the company's new OMNI-VISION® 3D Inspection Technology which combines 15 MegaPixel 2D inspection with advanced Digital Multi-Frequency Moire 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.

ISIS is an acronym for Infinitely Scalable Imaging Sensor. As the name implies the ISIS Vision System may be scaled or modified to address the specific inspection requirements of virtually any production environment without sacrificing speed or performance. The Technologically Advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices.

The Digital Multi Frequency Quad Moire Technology, provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four Moire Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MV-9 machines will also have four 10 MegaPixel Side-View Cameras in addition to the 15 MegaPixel Top-Down Camera.

Mirtec is also showing its MV-3L Desktop AOI System configured the exclusive 10 MegaPixel ISIS Vision System. This new optics system is comprised of a 10 MegaPixel Top-Down camera and a Precision 13.4 Micron Telecentric Compound Lens. The company's patented Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. The MV-3L will also be configured with Four 10 MegaPixel Side-View Cameras as well as the company's exclusive Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability in a cost-effective desktop AOI system. The MV-3L is powerful yet simple to use. A comprehensive Package Type Library provides simple Drag-and-Drop component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.

Contact: Mirtec Corp., 3 Morse Rd. #2A, Oxford, CT 06478 203-881-5559 fax: 203-881-3322 Web:
http://www.mirtecusa.com


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