Tuesday, October 24, 2017
VOLUME -27 NUMBER 9
Publication Date: 09/1/2012
Advertisements

Archive >  September 2012 Issue >  Front Page News > 
U.S. Mfg. Market Attracts Trans-Tec and Yamaha

Chandler, AZ — Start with an American businessman setting up shop in Singapore, with his goal to provide the best possible sales and service of electronic manufacturing machinery to OEMs and contract manufacturers in Southeast Asia. Couple his expertise and drive with a partnership with a large Japanese ...
Read More
IPC Releases On-Shoring Impact Study

Bannockburn, IL — Electronics manufacturing operations with a total value of at least $2.5 billion are expected to be brought to North America in the next three years, according to a much-anticipated new study, "On-Shoring in the Electronics Industry: Trends and Outlook for North America," published by IPC ... Read More
Electronic Product Packaging Guide Update

Arlington, VA — The Consumer Electronics Association (CEA)®, DIGITALEUROPE, and the Japanese Green Procurement Survey Standardization Initiative (JGPSSI) have released a guide for the supply chain disclosure of substances used in packaging for the global sale and distribution of electronic products.\par ...Read More
Protecting Banks and Customers with Layered Protection

Boston, MA — State Bank and Trust Company reportedly has experienced zero incidents of account takeover fraud since it deployed "Trusteer Pinpoint" and "Trusteer Rapport for Online Banking" to protect its commercial and retail customers from financial malware. According to State Bank and Trust, Trusteer was ...Read More
Baldrige Program After 25 Years

Gaithersburg, MD — Not many 25-year-olds can boast that in their short lifetime they have helped thousands of organizations develop and maintain world-class operations, innovative management, efficient procedures, involved workforces and highly satisfied customers. But one certainly can: the Baldrige Performance ...Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
search login