Save. Share. Connect.
Monday, January 16, 2017
VOLUME - NUMBER
Daily News Archive
Front Page Articles
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Daily News Archive
Add Message Board
Nordson YESTECH Highlights M1m Automated Optical Inspection Solution at IMAPS 2012
CARLSBAD, CA –
Nordson YESTECH, a subsidiary of Nordson Corporation and a leading supplier of automated optical and x-ray inspection systems for the electronics industry, will showcase their latest generation M1m AOI at IMAPS 2012, the 45rd Annual Symposium on Microelectronics, September 11-13 at the San Diego Town & Country Convention Center in San Diego, California. Demonstrations will be held in
Nordson YESTECH’s M1m AOI has specific design enhancements to directly address the unique inspection challenges presented by advanced packaging, complex wire bonding, epoxy splash and ever shrinking component sizes. Increased demand for smaller electronics is driving the microelectronics packaging industry to develop smaller, more efficient component level packages. Surface mounted components, such as flip chips, ball grid arrays (BGAs), and chip-scale packages (CSPs), are developed for use in high-volume production.
The M1m is designed for automated inspection of advanced microelectronics and semiconductor packages, with specific inspection algorithms for:
Wire bond inspection High accuracy die placement metrology, Surface finish inspection for, foreign objects and scratches Epoxy underfill Paste, glues and sealants, Material dimensional metrology. Nordson YESTECH’s advanced megapixel color technology offers high-speed device inspection with exceptional defect coverage all within a footprint less than 1 sq. meter. The M1m can be put in-line or off-line with an optional magazine loader/unloader.
Programming the M1m is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour*. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The M1m also provides SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device inspected.
“We look forward to attending the IMAPS show this year, and demonstrating our newest generation M1m AOI inspection system.” said Nordson YESTECH Manager, Scott Roberson. “With the rise of demanding microelectronics applications, the M1m meets the unique inspection requirements, offering the state-of-the art AOI technology.”
For pricing and availability call Nordson YESTECH's USA HQ at: 760-918-8471 or visit the Nordson YESTECH website at
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM