Tuesday, May 22, 2018
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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Archive >  August 2012 Issue >  Front Page News > 
Onshoring Momentum Powers Siplace Expansion

Atlanta, GA — The message was loud and clear at a recent ribbon-cutting and seminar in Suwanee, Georgia: manufacturing in the U.S. is having a marked resurgence, and Siplace is going to be a major contributor to this growth with its cutting-edge automated assembly equipment.
 
Siplace had been a Siemens company for many years, but the ownership changed hands in January, 2011 when Siplace was purchased by ASM Pacific Technology, a Hong Kong-based company. At the time, there was concern that a change in ownership would bring nothing but cutbacks and problems.
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Training Joystick Aviators


We are in the midst of a sea change in how military and flight simulation tools are developed, as commercial off the shelf (COTS) systems begin to replace expensive, custom-designed training simulators. Fueled by a drive to remove American service personnel from harm's way — as well ...
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IPC & JPCA Develop First Operational-Level Standard

Bannockburn, IL — In a joint effort, IPC — Association Connecting Electronics Industries® and JPCA (Japan Electronics Packaging and Circuits Association) have released the first operational-level standard for the rapidly evolving printed electronics industry. To help designers and companies create reliable ...Read More


 
 
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
BERLIN, GERMANY - Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two presentations and a booth, highlighting its latest solutions for flexible electronics as well as fan-out wafer-level and fan-out panel-level packaging.    
 
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