Wednesday, March 29, 2017
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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Archive >  August 2012 Issue >  Front Page News > 
Onshoring Momentum Powers Siplace Expansion

Atlanta, GA — The message was loud and clear at a recent ribbon-cutting and seminar in Suwanee, Georgia: manufacturing in the U.S. is having a marked resurgence, and Siplace is going to be a major contributor to this growth with its cutting-edge automated assembly equipment.
 
Siplace had been a Siemens company for many years, but the ownership changed hands in January, 2011 when Siplace was purchased by ASM Pacific Technology, a Hong Kong-based company. At the time, there was concern that a change in ownership would bring nothing but cutbacks and problems.
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Training Joystick Aviators


We are in the midst of a sea change in how military and flight simulation tools are developed, as commercial off the shelf (COTS) systems begin to replace expensive, custom-designed training simulators. Fueled by a drive to remove American service personnel from harm's way — as well ...
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IPC & JPCA Develop First Operational-Level Standard

Bannockburn, IL — In a joint effort, IPC — Association Connecting Electronics Industries® and JPCA (Japan Electronics Packaging and Circuits Association) have released the first operational-level standard for the rapidly evolving printed electronics industry. To help designers and companies create reliable ...Read More


 
 
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016: Rolf Aschenbrenner, deputy director of the Fraunhofer IZM; Eric Beyne, fellow and program director of 3D System Integration at imec; and Gilles Poupon,
 

SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.

MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
 

 
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