Monday, December 5, 2016
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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Archive >  August 2012 Issue >  Front Page News > 
Onshoring Momentum Powers Siplace Expansion

Atlanta, GA — The message was loud and clear at a recent ribbon-cutting and seminar in Suwanee, Georgia: manufacturing in the U.S. is having a marked resurgence, and Siplace is going to be a major contributor to this growth with its cutting-edge automated assembly equipment.
 
Siplace had been a Siemens company for many years, but the ownership changed hands in January, 2011 when Siplace was purchased by ASM Pacific Technology, a Hong Kong-based company. At the time, there was concern that a change in ownership would bring nothing but cutbacks and problems.
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Training Joystick Aviators


We are in the midst of a sea change in how military and flight simulation tools are developed, as commercial off the shelf (COTS) systems begin to replace expensive, custom-designed training simulators. Fueled by a drive to remove American service personnel from harm's way — as well ...
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IPC & JPCA Develop First Operational-Level Standard

Bannockburn, IL — In a joint effort, IPC — Association Connecting Electronics Industries® and JPCA (Japan Electronics Packaging and Circuits Association) have released the first operational-level standard for the rapidly evolving printed electronics industry. To help designers and companies create reliable ...Read More


 
 
Murphy, Choh and Pilla Join ClassOne Technology's Board of Advisors
KALISPELL, MT - ClassOne Technology (www.classone.com), manufacturer of advanced wet processing equipment for ≤200mm substrates announced the formation of a Board of Advisors. This body will be made up of highly-regarded senior executives from the semiconductor industry who will provide their perspective and guidance to ClassOne as it navigates the expansion of its operations.
 

Indium Corporation’s Karch Recognized for Best Presentation at IMAPS Autumn Conference 2016
CLINTON, NY - Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.

Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

Ventec International Group Focus On High Thermal Performance Materials for Automotive and LED Applications at HKPCA 2016, China
SUZHOU, CHINA - Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth #4B16 at HKPCA, China, scheduled to take place December 7th-9th, 2016 at the Shenzhen Convention & Exhibition Center, China.

 
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