Monday, April 23, 2018
VOLUME -27 NUMBER 8
Publication Date: 08/1/2012
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Archive >  August 2012 Issue >  Front Page News > 
Onshoring Momentum Powers Siplace Expansion

Atlanta, GA — The message was loud and clear at a recent ribbon-cutting and seminar in Suwanee, Georgia: manufacturing in the U.S. is having a marked resurgence, and Siplace is going to be a major contributor to this growth with its cutting-edge automated assembly equipment.
 
Siplace had been a Siemens company for many years, but the ownership changed hands in January, 2011 when Siplace was purchased by ASM Pacific Technology, a Hong Kong-based company. At the time, there was concern that a change in ownership would bring nothing but cutbacks and problems.
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Training Joystick Aviators


We are in the midst of a sea change in how military and flight simulation tools are developed, as commercial off the shelf (COTS) systems begin to replace expensive, custom-designed training simulators. Fueled by a drive to remove American service personnel from harm's way — as well ...
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IPC & JPCA Develop First Operational-Level Standard

Bannockburn, IL — In a joint effort, IPC — Association Connecting Electronics Industries® and JPCA (Japan Electronics Packaging and Circuits Association) have released the first operational-level standard for the rapidly evolving printed electronics industry. To help designers and companies create reliable ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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