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AIM to Showcase NC259 Solder Paste at IPC Midwest
CRANSTON, RI ―  
AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL.

This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. A virtual drop-in for SAC305, AIM’s NC259 was designed specifically for alloys such as SN100C and SAC0307. NC259 offers excellent print definition and consistent solder volume transfer. Additionally, the paste has proven to eliminate defects such as voiding and head-in-pillow as well as reduce graping on ultra-fine pads. Now, manufacturers can attain the SMT soldering results they require and pay significantly less per gram than with traditional lead-free solder pastes.


Also at the show, AIM will highlight its liquid fluxes, tin-lead and lead-free alloys, including SN100C. SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin, copper, and a small amount of nickel + germanium.


For more information about AIM, visit
www.aimsolder.com.

 
 
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