Tuesday, May 31, 2016
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Nordson YESTECH Launches Latest Gen AOI
M1m AOI system.
Carlsbad, CA — Nordson YESTECH, a subsidiary of Nordson Corporation is showcasing its latest generation M1m AOI which is designed for automated inspection of advanced microelectronics and semiconductor packages.

The system has specific inspection algorithms for: wire/wire bond inspection: presence, quality, position; high accuracy die inspection; surface finish inspection for contamination, scratches and chip-outs; epoxy underfill; paste/epoxy squeeze-out and bridging; material dimensional inspection.

The company's advanced megapixel color technology offers high-speed device inspection with exceptional defect coverage all within a footprint less than 1 sq. meter. The M1m can be put in-line or operated off-line with an optional magazine loader/unloader. The machine can be put in-line with wire bonders or off-line to support several bonders

Programming is fast and intuitive. With CAD data input, a complete recipe can be completed in less than 1 hour. The offline programming option allows the engineer to create complete recipes at any remote location, without affecting production. The machine also provides SPC data, defect reports, offline defect classification, offline rework capability and even archived images of every device inspected. In addition, Nordson YESTECH also provides free software upgrades for the life of the system.

Contact: Nordson YESTECH, 2762 Loker Avenue West, Carlsbad, CA 92010 760-918-8471 fax: 760-918-8472 Web:
http://www.nordsonyestech.com


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