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InstaRack from Sollega Simplifies Solar Installs
Publication Date: 6/29/2012

San Francisco, CA — The InstaRack ballasted solar racking system, from Sollega, is designed to make flat roof solar installations faster and easier. The InstaRack is quick to install and has the least number of parts of all racking systems currently on the market.
Ticona Intros High Flow Polymers for Mobile Devices
Publication Date: 6/29/2012

Florence, KY — Ticona Engineering Polymers has extended its Vectra® portfolio of halogen-free liquid crystal polymers (LCP) to include a new family of high-flow, high-performance thermoplastics for use in today's electronic portable devices.
Yamaichi: CFP MSA Compliant Connector Family
Publication Date: 6/29/2012

San Jose, CA — Yamaichi Electronics USA is introducing its CFP connector product family CA009 series which complies with the CFP Multi-Source Agreement (MSA) specification. CFP MSA defines optical transceiver form factor to enable 40Gbps and 100Gbps applications. The CA009 series, currently in mass-production ...
Nordson YESTECH Launches Latest Gen AOI
Publication Date: 6/29/2012

Carlsbad, CA — Nordson YESTECH, a subsidiary of Nordson Corporation is showcasing its latest generation M1m AOI which is designed for automated inspection of advanced microelectronics and semiconductor packages.
TDK Publishes Product Profile for Pressure Sensor Dies
Publication Date: 6/29/2012

Iselin, NJ — TDK-EPC, a group company of TDK Corporation, has published a new Product Profile that describes EPCOS brand Pressure Sensor Dies. Included are key technical parameters for the C27, C29, C32 and C33 sensor dies for absolute and gauge pressure measurement; sensor dies for the rear-side ...
GPD Global: Dispensing Systems for LEDs
Publication Date: 6/29/2012

Grand Junction, CO — GPD Global is showing its precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production. Included is a live demonstration of the new Island 3S benchtop manufacturing solution. The dispense system has a large work area of 12 x 16-in. (305 x 406mm ...
Kyzen: Advanced Packaging Chemistry
Publication Date: 6/29/2012

Nashville, TN — Kyzen is showing the proven technology of its AQUANOX® A4520, a highly tested aqueous cleaner for flip chips and advanced packaging that has proven to be effective on all lead-free, no-clean, and eutectic materials when run at low temperatures and low concentrations. Easy to use ...
Nordson DAGE: Bond Test and X-Ray Solutions
Publication Date: 6/29/2012

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, is featuring its 4000Plus Bondtester, which the company describes as the new industry standard in bond testing with extraordinary data accuracy and repeatability. The company's bond test technology meets the requirements ...
Ultrasonic Systems Adds New Coating System Options
Publication Date: 6/29/2012

Haverhill, MA — Ultrasonic Systems, Inc. (USI) has developed new options for its MAX-800 coating system to accommodate the expanding list of customer coating requirements. The new system leverages the company's proprietary, nozzle-less ultrasonic spray head technology for the thin, uniform application ...
Virtual Unveiling New Wafer-Vac System
Publication Date: 6/29/2012

Colorado Springs, CO — Virtual Industries Inc. is introducing its new WV-9000 WAFER-VAC System for handling wafers and solar cells. With the new system, no in-house air plumbing is required. The general purpose wafer vacuum handling tool plugs directly into 110VAC 50/60Hz mains.
Precision Dispensing Systems from Nordson EFD
Publication Date: 6/29/2012

Providence, RI — Nordson EFD is showing its precision dispensing systems for applying accurate, consistent amounts of the solder pastes, conductive adhesives, fluxes and RTV sealants used in PV assembly processes. Controlled fluid application maximizes cell efficiency and reliability, while increasing productivity and yield.

Products include tabletop dispensing robots; auger valves for fast, precise deposits of solder paste; precision spray valves for neat, uniform application of liquid flux; and non-contact jetting systems capable of applying adhesives and other materials at speeds up to 150 cycles per second,
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