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NEPCON South China '16
SEMICON West '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
IPC/APEX '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
SMTAI '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
SEMICON West '13
Electronics West/MDM and IPC/APEX '13
APEX 11
APEX 12
electronica '14
electronica 10
SEMICON West '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
IPC APEX '14
Electronics West/MDM 10
EDS 08
ATX Midwest, IMAPS, PCB West '13
ATX West '14
APEX 10
EDS 09
Productronica 07
ATExpo & IPC MW 07
SMTAI '12
electronica '12
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
NEPCON China Product Preview '12
Atlantic Design/MDM 10
Productronica 11
EDS 11
Electronics West/MDM 11
SEMICON WEST 10
EDS 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
Atlantic Design/MDM 09
SEMICON WEST 08
NEPCON South China '13
ATExpo & IPC MW 08
EDS 07
Electronics West/MDM 08
NEPCON China Product Preview '13
APEX 08
Electronic West/MDM 09
SMTAI and productronica '13
Autotestcon 11
Multi tradeshow Product Preview '12
AATE/IPC Midwest 10
Electronics West/MDM 12
ATE and IPC MW 09
Productronica 09
APEX 09
electronica 08
SMTAI and productronica '13
Atlantic Design/MDM 08
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SEMICON WEST/Intersolar '12
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InstaRack from Sollega Simplifies Solar Installs
Publication Date:
6/29/2012
San Francisco, CA — The InstaRack ballasted solar racking system, from Sollega, is designed to make flat roof solar installations faster and easier. The InstaRack is quick to install and has the least number of parts of all racking systems currently on the market.
Ticona Intros High Flow Polymers for Mobile Devices
Publication Date:
6/29/2012
Florence, KY — Ticona Engineering Polymers has extended its Vectra
®
portfolio of halogen-free liquid crystal polymers (LCP) to include a new family of high-flow, high-performance thermoplastics for use in today's electronic portable devices.
Yamaichi: CFP MSA Compliant Connector Family
Publication Date:
6/29/2012
San Jose, CA — Yamaichi Electronics USA is introducing its CFP connector product family CA009 series which complies with the CFP Multi-Source Agreement (MSA) specification. CFP MSA defines optical transceiver form factor to enable 40Gbps and 100Gbps applications. The CA009 series, currently in mass-production ...
Nordson YESTECH Launches Latest Gen AOI
Publication Date:
6/29/2012
Carlsbad, CA — Nordson YESTECH, a subsidiary of Nordson Corporation is showcasing its latest generation M1m AOI which is designed for automated inspection of advanced microelectronics and semiconductor packages.
TDK Publishes Product Profile for Pressure Sensor Dies
Publication Date:
6/29/2012
Iselin, NJ — TDK-EPC, a group company of TDK Corporation, has published a new Product Profile that describes EPCOS brand Pressure Sensor Dies. Included are key technical parameters for the C27, C29, C32 and C33 sensor dies for absolute and gauge pressure measurement; sensor dies for the rear-side ...
GPD Global: Dispensing Systems for LEDs
Publication Date:
6/29/2012
Grand Junction, CO — GPD Global is showing its precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production. Included is a live demonstration of the new Island 3S benchtop manufacturing solution. The dispense system has a large work area of 12 x 16-in. (305 x 406mm ...
Kyzen: Advanced Packaging Chemistry
Publication Date:
6/29/2012
Nashville, TN — Kyzen is showing the proven technology of its AQUANOX
®
A4520, a highly tested aqueous cleaner for flip chips and advanced packaging that has proven to be effective on all lead-free, no-clean, and eutectic materials when run at low temperatures and low concentrations. Easy to use ...
Nordson DAGE: Bond Test and X-Ray Solutions
Publication Date:
6/29/2012
Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, is featuring its 4000Plus Bondtester, which the company describes as the new industry standard in bond testing with extraordinary data accuracy and repeatability. The company's bond test technology meets the requirements ...
Ultrasonic Systems Adds New Coating System Options
Publication Date:
6/29/2012
Haverhill, MA — Ultrasonic Systems, Inc. (USI) has developed new options for its MAX-800 coating system to accommodate the expanding list of customer coating requirements. The new system leverages the company's proprietary, nozzle-less ultrasonic spray head technology for the thin, uniform application ...
Virtual Unveiling New Wafer-Vac System
Publication Date:
6/29/2012
Colorado Springs, CO — Virtual Industries Inc. is introducing its new WV-9000 WAFER-VAC System for handling wafers and solar cells. With the new system, no in-house air plumbing is required. The general purpose wafer vacuum handling tool plugs directly into 110VAC 50/60Hz mains.
Precision Dispensing Systems from Nordson EFD
Publication Date:
6/29/2012
Providence, RI — Nordson EFD is showing its precision dispensing systems for applying accurate, consistent amounts of the solder pastes, conductive adhesives, fluxes and RTV sealants used in PV assembly processes. Controlled fluid application maximizes cell efficiency and reliability, while increasing
productivity and yield.
Products include tabletop dispensing robots; auger valves for fast, precise deposits of solder paste; precision spray valves for neat, uniform application of liquid flux; and non-contact jetting systems capable of applying adhesives and other materials at speeds up to 150 cycles per second,
...
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