Wednesday, July 27, 2016
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Engineered Material Systems Debuts New UV-Cure Adhesive
UV-cure adhesive available in many containers.
Delaware, OH — New from Engineered Material Systems is its 535-10M UV-Cured Epoxy, formulated for disk drive, camera module, optoelectronics and circuit assembly applications. This new non-conductive UV-cured adhesive cures rapidly when exposed to high intensity UV light. It is a low outgassing, flexible, high strength epoxy adhesive that does not contain antimony.

The new material was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. It is the latest addition to the company's extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

Contact: Engineered Material Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web:
http://www.conductives.com.

 
 
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