Save. Share. Connect.
Monday, January 23, 2017
VOLUME -27 NUMBER 7
Publication Date: 07/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Production
Semicon West / Intersolar Product Preview
July 2012 Issue
Add Message Board
Thermal Interface Medium from Fujipoly
New TIM pads under ICs.
Carteret, NJ — New from Fujipoly is its Sarcon
25GR-T2d, a very soft highly conformable thermal interface medium that is suitable for both low-and high-volume production applications. The reinforced 0.25mm thick TIM also offers engineers a durable and economical solution for tight tolerance die-cut operations. When placed between a heat source such as a semiconductor and a nearby heat sink, this gap filler pad provides a thermal conductivity of 1.5W/m°K and a thermal resistance as low as 0.33°C-in.
The TIM material is recommended for applications with operational temperatures between -40 and +150°C. Convenient pre-cut sheets are available up to a maximum size of 200 x 400mm.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM