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Thursday, August 25, 2016
VOLUME -27 NUMBER 7
Publication Date: 07/1/2012
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Special Features: Assembly and Production
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July 2012 Issue
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Thermal Interface Medium from Fujipoly
New TIM pads under ICs.
Carteret, NJ — New from Fujipoly is its Sarcon
25GR-T2d, a very soft highly conformable thermal interface medium that is suitable for both low-and high-volume production applications. The reinforced 0.25mm thick TIM also offers engineers a durable and economical solution for tight tolerance die-cut operations. When placed between a heat source such as a semiconductor and a nearby heat sink, this gap filler pad provides a thermal conductivity of 1.5W/m°K and a thermal resistance as low as 0.33°C-in.
The TIM material is recommended for applications with operational temperatures between -40 and +150°C. Convenient pre-cut sheets are available up to a maximum size of 200 x 400mm.
Contact: Fujipoly America Corporation, P.O. Box 119, Carteret, NJ 07008
732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web:
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