Tuesday, May 24, 2016
VOLUME -27 NUMBER 7
Publication Date: 07/1/2012
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ARCHIVE >  July 2012 Issue >  Production > 
Copper Wire Bonded Devices: Using Plasma Mold Decap


Copper has been replacing gold for wire bonding to enhance performance and reduce semiconductor package costs. While beneficial for the customer, it presents challenges for those performing failure analysis of molded copper bonded parts. Gold is immune to attack from the fuming acids used to etch ...
 
 
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