Saturday, May 26, 2018
VOLUME -27 NUMBER 7
Publication Date: 07/1/2012
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Archive >  July 2012 Issue >  Front Page News > 
SMTA China Names Megan Wendling Councilor of the Year

Shanghai, China — Megan Wendling, president of MW Associates, a global all-electronics marketing and electronics assembly consultancy agency, was presented with the Councilor of the Year Award by SMTA China for the sixth consecutive year. The award was received during SMTA China's annual ...
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Constant Expansion at Saline


At 110,000-ft.2, the very large static-controlled manufacturing floor at Saline Lectronics is constantly humming, and has recently been upgraded by the addition of new equipment from Juki.
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New IPC Survey to Measure On-Shoring in the Electronics Industry

Bannockburn, IL — IPC — Association Connecting Electronics Industries® has launched a survey to measure the impact of a phenomenon known as "on-shoring" — the migration of manufacturing operations back to the Americas from overseas, in the electronics industry. Read More
IPC Board Chairman Urges Changes to SEC Rule Proposal

Washington, DC — Steve Pudles, Chairman of the Board of IPC — Association Connecting Electronics Industries®, recently testified before Congress to urge common-sense changes to the U.S. Securities and Exchange Commission (SEC) proposed rule on conflict minerals. IPC is advocating changes to the draft SEC ...Read More


 
 
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY - Indium Corporation will feature its precision AuSn solder preforms at International Microwave Symposium (IMS) 2018 from June 10-15 in Philadelphia, Penn.

Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.         

SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.         
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.        
 
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