Wednesday, October 18, 2017
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Würth Elektronik eiSos presents WE-DPC HV Power Choke

Smallest Coupled Power Choke

WALDENBURG, GERMANY - WE-DPC HV (Double Power Choke High Voltage) is a magnetically shielded, SMD coupled power choke with two identical windings and a high isolation voltage of 1.5 kV. It is the smallest product of its type in the Würth Elektronik eiSos portfolio.
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Increase manufacturing efficiency with Herrmann Ultrasonics’ HiQ DIALOG

Cycle time, change over and downtime are three factors that majorly affect manufacturing efficiency and can be significantly and efficiently reduced with the HiQ DIALOG.

BARTLETT, IL - The programmable stroke selection (start and end position of the sonotrode) optimizes cycle time. The stroke can be individually adjusted for the required weld task and the size of application being welded. SoftTouch mode prevents damage to sensitive joints by allowing for a quick approach with gentle contact to the application.

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UNEX Exhibits Lineside Picking and Flow Cell Solutions at The Assembly Show

Better Manage Materials, Improve Productivity, Quicken Delivery Schedules

LAKEWOOD, NJ - UNEX Manufacturing, Inc., the trusted industry leader in providing innovative order picking solutions, will be exhibiting their advanced order picking and lineside storage solutions at The Assembly Show in Booths 1231 and 1331 at the Donald E. Stephens Convention Center in Rosemont, IL.
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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements: Accommodate frequencies up to 18 GHz

SAN DIEGO, CA - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices.
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Digi-Key: PUI Audio Exciter - Another Geek Moment

Harwin: Metal Backshells with Built-In Shielding Ensure Ongoing Electrical & Mechanical Integrity

PORTSMOUTH, UK - To complement its widely-used Datamate wire-to-board connector offering, hi-rel connector manufacturer Harwin now supplies a comprehensive range of backshells with a rugged aluminium alloy construction and electroless nickel plating.
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Nippon Pulse introduces four-axis FMAX box controller with built-in driver

RADFORD, VA – Nippon Pulse is excited to announce its first box-level controller to join its chip and board controller product lines. The FMAX-4X-2SD is a box controller for up to four axes of movement, with built-in servo drivers for the X and Y axes. The X and Y axes can control rotary and linear brushless motors, such as Nippon Pulse’s Linear Shaft Motor servo; the Z and U axes can control other types of motors by connecting additional drivers.

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Metcal Introduces Digital Hot Air Pencil for Light Rework Applications

CYPRESS, CA ― October 13, 2017 ― Metcal today announced the introduction of its new HCT2-200 Digital Hot Air Pencil. The HCT2-200 is the latest addition to Metcal’s line of convection rework tools. This digital handheld convection tool is designed for use in light rework applications that use smaller components and integrated circuits.

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Fujipoly: Reinforced Thermal Interface Thin Film

Carteret, NJ — Sarcon® 20GAR from Fujipoly® is a high-performance, glass fabric reinforced thermal interface material that is perfect for complex die-cut shapes. It delivers a thermal conductivity of 3.0 W/mK while exhibiting a thermal resistance of only .17°Cin2/W.

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Compact 6-Axis Motion Controller for High Precision Positioning Applications in Industry and Research

PI’s new cost-efficient servo motor controller drives 6 and 4 axis motion systems.

Auburn, MA – Precision positioning systems industry leader PI (Physik Instrumente) has released a new 6-axis servo motor controller – the C-884.6DC. Most modern precision motion systems are driven by servo motors, because they provide high torque, fast acceleration, smooth motion with a wide dynamic speed range, and fast start stop performance. 

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Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC

Booth #1

AYLESBURY, UK - Nordson DAGE, a division of Nordson Corporation, announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA. The Nordson DAGE inspection experts will discuss the XM8000 Wafer X-ray Metrology Platform in Booth #1.
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ASM’s Wide Range of Smart Manufacturing Tools and Solutions Is a Visitor’s Magnet

SUWANEE, GA - An overall positive mood in the Northern American electronics manufacturing industry was reflected by large visitors at SMTA International 2017, September 19-20, in Rosemont, Illinois. Clearly the most prominent topic of interest: smart manufacturing tools and concepts and how to realize them.
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Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at IWLPC 2017

CLINTON, NY - Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.

Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG). 

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KIC releases new smart technology for real-time insight into reflow and wave solder processes

SAN DIEGO, CA - KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device.
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Viscom presents powerful 3D AOI and SPI with ultra-modern data exchange for Industry 4.0 at SMTA Guadalajara

HANOVER, GERMANY - Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0. 

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Libra Industries Hires Senior PCB Designer

MENTOR, OH - Libra Industries, a privately held electronics manufacturing services (EMS) provider, is pleased to announce that it has hired Alan Vannasy as a Senior PCB Designer. Vannasy is an electronics packaging designer with more than 12 years of experience in the design and development of new mechanical designs and printed circuit board designs, from initial concept to production.
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Specialty Coating Systems Debuts New-Generation Omegameter SMD 650 Ionic Testing System

INDIANAPOLIS, IN - Specialty Coating Systems (SCS) announced today the launch of the Omegameter SMD 650, the next-generation, software-controlled Omegameter ionic contamination test system.

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Alpha to Showcase Latest Products for SMT Assembly at productronica, Munich, Germany

Hall B3, Booth 272

SOMERSET, NJ - Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November. 

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Pillarhouse International: Selective Meets The Wave

Productronica 2017, Hall 4 Booth 220

CHELMSFORD, UK - Over recent years there has been a big push to try and remove wave soldering from the through -hole assembly process. This is not always possible. Common wave associated problems such as bridging between pins and skipped joints etc. inevitably require a high reliance for a re-work function with this mode of operation.

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Pickering Interfaces to Introduce New PXI and LXI Switching Solutions at productronica 2017

Booth A1.452

CLACTON-ON-SEA, UK - Pickering Interfaces, a leading provider of signal switching and simulation solutions used in electronic test and verification, will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation at productronica 2017 in Munich, November 14th to 17th, Booth A1.452.

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