Save. Share. Connect.
Wednesday, February 22, 2017
VOLUME - NUMBER
Daily News Archive
Front Page Articles
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Daily News Archive
Add Message Board
StratEdge Introduces Laminate Packages for High Power GaN Devices
SAN DIEGO, CA -
, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012
. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages handle applications through 6 GHz for use in RF radios for communications, radar, and high power millimeter-wave signals.
The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip. The LL802302 is 0.8" (20.32mm) long x 0.39" (9.91mm) wide with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board. The LL362302 is a flangeless, fully hermetic version of the LL802302 package, and has a flat ceramic lid. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. Hermeticity is especially critical in aerospace and defense applications.
"StratEdge's new laminate power packages solve thermal problems encountered when using GaN devices," explained Tim Going, StratEdge president. "The excellent thermal conductivity of the CMC base enables use of GaN devices in high power applications, and the flange package facilitates manufacturing. StratEdge is continuing to develop packages to handle the requirements of today's new materials and devices."
IMS2012 is being held in The Palais de Congres, Montreal, Canada from June 19-21, 2012. Visit StratEdge at
to discuss your packaging requirements.
StratEdge Corporation, founded in 1992, designs, manufactures, and provides test and assembly services for a complete line of high performance semiconductor packages operating from DC to 50+ GHz for the high speed digital, mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters. StratEdge offers ceramic, low cost molded ceramic, and metal packages. All packages are lead-free and most meet RoHS and WEEE standards. For more information contact StratEdge Corporation at 866-424-4962, email:
, or visit the website at
See StratEdge at IMS2012 Booth #1625
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM