Irvine, CA — Henkel has recently expanded its low-pressure molding MACROMELT technology portfolio, adding a material designed specifically for high thermal stability and chemical resistance. The product, MACROMELT MM6208, has all of the inherent benefits consistent with MACROMELT technology, but has a high (95°C) Relative Temperature Index (RTI) rating making it suitable for certain automotive, consumer and appliance applications where a very high RTI rating is required for good thermal stability. In fact, at 95°C, the product carries the highest RTI rating in its class of materials, as the majority of hot melt systems have RTIs of 65°C or less.
|Before (left) and after encapsulating. |
Like all MACROMELT materials, MM6208 has been designed with superior performance, device protection and ease-of-use at its core. These unique materials are polyamide-based hot melt formulas that can quickly over-mold, encapsulate and protect exposed circuitry while simultaneously forming the product?s outer shell. Once
encapsulated, the product becomes a self-contained integrated assembly.
In use, an exceptionally low application pressure of between 20 and 500 psi is all that is needed, which greatly reduces stress and damage for sensitive electronic components and its very low modulus and hardness make it well-suited for flexible applications. With one of the lower melting point materials available, it provides easier encapsulation of ceramics, wire bonds and leaded solder joints.
The material is available in two different 95°C RTI-rated versions — MM6208 in an amber color and MM6208S in black.
Contact: Henkel Corp., 1400 Jamboree Rd., , Irvine, CA 92606 714-368-8000 949-789-2500 fax: 714-368-2265 E-mail: firstname.lastname@example.org Web: http://www.henkel.com/electronics