Thursday, April 27, 2017
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Stencil Printing Challenges for Small Devices


The very small form factor of today's QFNs (quad flatpack, no leads), DFNs (dual flatpack, no leads), and µBGAs allows for smaller packages, and thus smaller electronic devices with more overall functionality, especially in the newer mobile devices. QFNs stand out because they provide  better grounding and better heat sink thermal properties compared to other SMT packages. Most QFNs have a metal pad on the underside for grounding and heat conduction. DFNs have a...

 
 
 
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