Chandler, AZ — Rogers Corporation's low-loss RT/duroid® 5880LZ laminates and their high thermal conductivity RT/duroid 6035HTC circuit materials are printed-circuit-board (PCB) laminate materials designed for commercial and military satellite-communications (satcom) electronic applications.\par \RT/duroid 6035HTC is a ceramic-filled, PTFE composite material designed especially for high-frequency, high-power applications, such as antenna beam-forming networks and power amplifiers for wireless cellular communications networks. With a relative dielectric constant of 3.50 at 10GHz, low loss by merit of its dissipation factor of 0.0013 at 10GHz, the high-thermal-conductivity (HTC) fluoropolymer composite contains a special filler system, enabling a thermal conductivity of 1.44W/m/K, while maintaining low drill wear versus other competitive offerings.
|Laminates for outer space. |
In addition, when high electrical performance versus weight is critical, the RT/duroid 5880LZ laminate materials provide the industry's lowest available dielectric constant of 1.96 in the z-axis at 10GHz with a TCDk of +22ppm/°C. RT/duroid 5880LZ is also light weight, having a specific gravity of 1.3 to 1.4, making it suitable for airborne satellite applications. These materials offer low loss, evidenced by a dissipation factor of typically 0.0019 at 10GHz. Usable at satellite frequencies to Ku-band and beyond, these RoHS-compliant circuit materials have a low z-axis coefficient of thermal expansion (CTE) of 41.5ppm/°C for reliable plated-through holes (PTHs) in multilayer circuits.
Contact: Rogers Corporation, P.O. Box 188, Rogers, CT 06263-0188 860-774-9605 fax: 860-779-5509 Web: http://www.rogerscorp.com