Delaware, OH — Engineered Material Systems, Inc. is introducing its 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications. This new encapsulant/adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. The material has excellent chemical resistance to inks.
The new material has very high fracture toughness and high adhesion to flexible circuits, FR4 and metal substrates. It meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.
The 357-348 encapsulant/adhesive is the latest addition to the company's extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Contact: Engineered Material Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web: http://www.conductives.com.